For over three decades, breakthrough advances in computing and intelligent systems have been driven by innovation at the intersection of physics, materials, manufacturing, and engineering. The next generation of high-performance technologies will require entirely new approaches to semiconductor processing, integration, and scalable device fabrication.
We are looking for a Senior Process Engineer to help develop advanced semiconductor device technologies from early research through process integration and pilot manufacturing. This role combines hands-on cleanroom work, process development, external partner coordination, and deep technical problem solving across complex wafer fabrication flows.
You will work closely with multidisciplinary R&D teams to enable next-generation device platforms through advanced process engineering and integration.
What you’ll be doing:
- Develop and optimize semiconductor wafer fabrication processes across multiple process modules.
- Drive process integration from incoming wafer through fully processed devices.
- Work hands-on in the cleanroom across lithography, dry etch, wet etch, dielectric deposition, implantation, metallization, and wafer handling processes.
- Develop and qualify advanced substrate preparation, thinning, bonding, and backside processing flows.
- Define process characterization strategies including CD control, overlay budgets, metrology, and defect inspection.
- Partner with external vendors and manufacturing partners to support complex multi-site wafer flows.
- Drive DOE learning cycles, root-cause investigations, yield analysis, and process optimization.
- Collaborate with device, characterization, packaging, and reliability teams to correlate process behavior with device performance.
- Build scalable process documentation, travelers, specifications, and process-control methodologies.
- Support transfer of development processes into pilot manufacturing environments.
What we need to see:
- BS, MS, or PhD in Materials Science, Physics, Electrical Engineering, Chemical Engineering, or related field.
- 5+ years of semiconductor process development experience.
- Strong hands-on cleanroom experience across multiple semiconductor processing modules.
- Experience with compound semiconductor or advanced device processing preferred.
- Understanding of lithography, etch, dielectric deposition, implantation, metallization, and process integration.
- Experience working with process characterization, SPC, DOE, and failure analysis methodologies.
- Strong experimental problem-solving and debugging skills.
- Ability to work effectively across multidisciplinary engineering teams.
Ways to stand out from the crowd:
- Experience developing advanced or non-standard semiconductor process flows.
- Experience with wafer bonding, substrate removal, or heterogeneous integration.
- Strong process integration mindset with broad cross-module understanding.
- Experience building scalable process infrastructure in R&D environments.
- Familiarity with advanced metrology and defect characterization techniques.
- Demonstrated ability to rapidly iterate and solve complex process problems.
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