- Develop and understand concept and architecture level diagrams.
- Circuit design and Schematic capture.
- Define stack-up and own PCB layout design.
- Board bring-up, testing and characterization, and debug.
- Power and signal integrity analysis.
- Lead technical discussions with customer engineering teams.
- Bachelor's degree in Electronics Engineering.
- 3+ years of professional experience designing mixed signal electronics and multi-layer PCBs.
- Knowledge in HDI design principals.
- Solid understanding of circuit design fundamentals: power supplies, signal integrity, sensor interfacing, and communication protocols (I2C, SPI, UART, CAN).
- Experience in bringing up and debugging hardware using lab equipment (oscilloscopes, multimeters, logic analyzers, power supplies).
- Ability to read and produce clear technical documentation, including schematics, BOMs.
- Strong collaboration and communication skills.
Preferred Qualifications
- Master's degree in Electronics Engineering.
- Prior experience with high speed board design (PCIe/DDR3 implementation).
- Experience in RF design projects.
- Experience with industrial-grade product design, including EMI/EMC considerations.
- Experience in embedded firmware (C/C++) development.
- Familiarity with relevant compliance and safety standards (e.g., UL, CE, FCC, IEC 61010).
- Flat hierarchies, direct communication, and a backbone of integrity, courage, responsibility.
- A fast-moving environment where momentum is not lost in approval loops.
- Collaborate with colleagues and customers across countries, industries, and perspectives.
- A workplace shaped by technology, curiosity, and continuous improvement.
- Challenges with scale, depth, and enough complexity to keep you learning.