Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. Job Description: Broadcom is seeking an experienced package design engineer for complex flip-chip-BGA packages for industry-leading ASICs with high-speed SerDes and RF/microwave communications A/D-D/A converters (ADC & DAC). You will be part of a worldwide R&D team developing high-performance package designs for ASICs used in artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. These designs include SerDes at 200G and higher, RF/Microwave ADC/DAC, DDR, HBM, and more. You'll have the opportunity to collaborate with the team to create the package structures needed to enable new design. RESPONSIBILITIES: Overall design responsibility for ASIC package designs (layout/routing), including aspects of impedance matching, crosstalk, signal integrity, power integrity, manufacturability, reliability, and thermal, in partnership with our experienced team of package engineering experts. Package Design of critical high frequency/datarate structures for SerDes, ADC/DAC, DDR, HBM, etc. Schedule, prioritize, & track your work across multiple projects simultaneously General flip-chip BGA package design & engineering EDUCATION/EXPERIENCE & REQUIREMENTS: B.Eng (EE/EEE) or similar field and 5+ years’ experience in flip-chip-BGA package design, including high-speed SerDes M.Eng (EE/EEE) or similar field and 3+ years’ experience in flip-chip-BGA package design, including high-speed SerDes Knowledge of package-level signal integrity and power integrity, to apply to package designs Cadence APD (allegro package designer) experience is preferred. Equivalent tools will also be considered. Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers. Good organizational and task management skills to manage multiple package design projects. PREFERRED EDUCATION/EXPERIENCE & REQUIREMENTS: B.Eng (EE/EEE) or similar field and 8+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred. M.Eng (EE/EEE) or similar field and 6+ years’ experience in flip-chip-BGA package design, including high-speed SerDes preferred. Experience with 2.5D and 3DIC packages is highly advantageous. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence. Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library and check out our Connected by Broadcom series. Follow us on Linked In Broadcom Inc.

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8 Oct, 2026

Broadcom

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USA-Colorado-Colorado Springs-4420 Arrowswest Drive, United States of America

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