THT & Soldering is responsible for leading Through-Hole Technology (THT) and soldering operations, including wave, selective, and manual soldering processes. Based on benchmarking of more than 30 comparable industry job descriptions, this role demands deep expertise in solder metallurgy, flux chemistry, thermal dynamics, and high-reliability solder joint formation.
Lead optimization of wave soldering profiles including flux application, preheat configuration, dwell time, and conveyor speed.
Own selective soldering programming and nozzle optimization.
Standardize manual soldering operations and manage operator certification programs.
Reduce defects including solder bridges, insufficient fill, icicles, solder skips, and blow holes.
Perform root cause analysis using cross-sections, microanalysis, and solder joint inspection techniques.
Develop and maintain work instructions and training materials aligned with IPC standards.
Drive CAPA implementation and continuous improvement projects.
Support tooling, fixture design, and automation upgrades
Bachelor’s degree in Electrical, Electronics, Industrial, or Mechanical Engineering.
Minimum 5 years of THT process engineering experience in electronics manufacturing.
Advanced knowledge of IPC-A-610 and J-STD-001 standards.
Strong knowledge of solder alloys (SnAgCu, SnPb), flux systems, and thermal management
Experience in automotive, aerospace, or medical electronics preferred.
Good command in English.