SAAZ Micro is seeking a talented PCB Design Engineer to design printed circuit board electronics for next-generation electro-optical (EO), infrared (IR), and visible camera products used in aerospace, defense, autonomous systems, and scientific imaging. The engineer will work closely with Product Engineering, FPGA, Digital IC, Mechanical, Software, and Systems Engineering teams to design, develop, integrate, and validate camera electronics from concept through production.
The ideal candidate has extensive experience designing complex multilayer PCBs with high-speed digital interfaces, precision analog circuitry, image sensors, FPGAs, power electronics, and EMI/EMC best practices.
Key Responsibilities:
• Design multilayer PCBs for high-performance imaging systems and camera electronics.
• Develop PCB layouts from schematics through manufacturing release.
• Collaborate with electrical engineers to optimize component placement and routing.
• Design boards incorporating FPGAs, DDR3/DDR4/LPDDR memory, CMOS image sensors, ADCs/DACs, ARM processors, power supplies, and precision analog front ends.
• Perform high-speed signal integrity layout for interfaces including DDR, USB 3.x, PCI Express, Gigabit Ethernet, Camera Link, CoaXPress, MIPI CSI-2, and LVDS.
• Develop camera hardware platforms, including schematic capture and PCB layout for sensor interfaces, power regulation, timing control, and data transmission.
• Develop controlled-impedance stack-ups with PCB fabricators.
• Ensure compliance with EMI/EMC, thermal, manufacturability, and reliability requirements.
• Bring up and debug new hardware using oscilloscopes, logic analyzers, and protocol analyzers.
• Document designs and interface specifications and support hardware validation and production.
Required Qualifications:
• B.S. or M.S. in Electrical Engineering, Computer Engineering, or related field.
• 5+ years of camera PCB design experience.
• Expert knowledge of PCB CAD tools such as Altium Designer, Cadence Allegro, or OrCAD PCB Designer.
• Experience designing complex multilayer boards (8–20+ layers).
• Strong understanding of controlled-impedance routing, differential pairs, high-speed timing constraints, return-current paths, and crosstalk reduction.
Desired Qualifications:
• Experience interfacing with visible and IR image sensors.
• Understanding of power regulation, analog/digital separation, and signal integrity.
• Experience with multilayer PCB layout, high-speed digital and mixed-signal design, controlled-impedance routing, differential-pair matching, power integrity, signal integrity, EMI/EMC mitigation, and thermal analysis.
Success Metrics:
• Deliver PCB layouts on schedule with minimal design revisions.
• Achieve first-pass fabrication success and reduce board re-spins through robust design practices and reviews.
• Meet signal integrity, EMI/EMC, thermal, and reliability targets.
• Successfully support prototype bring-up and transition to production.
• Develop and maintain standardized PCB libraries and layout guidelines.
• Improve design efficiency through reusable practices and documentation.
• Ensure designs support manufacturability (DFM), assembly (DFA), and testability (DFT).