Product Manager Multi-Die Package / System-in-Package Products Job Description 1. Market Insight and Analysis · Closely monitor market dynamics and technology trends for highly integrated semiconductor products, including multi-die packages and system-in-package solutions that combine MCUs, gate drivers, power devices, power-management devices, and memory devices. · Analyze target applications, customer needs, competitor portfolios, supply-chain conditions, cost structures, and packaging technology roadmaps; regularly deliver market research, opportunity assessments, and product strategy recommendations. · Work closely with sales, field application, engineering, operations, and key customers to identify system-level pain points and translate them into differentiated integration opportunities and product concepts. 2. Product Definition and Management · Develop product roadmaps and portfolio plans for multi-die package products; define product positioning, target markets, application scenarios, competitive value propositions, and business priorities. · Lead system-level product definition across MCU, gate-driver, power-device, power-management, and memory functions, balancing electrical performance, thermal performance, reliability, package size, cost, manufacturability, and supply continuity. · Define package architecture, die partitioning, interconnection approach, pinout, power and signal integrity requirements, thermal design targets, test strategy, quality and reliability goals, and hardware/software ecosystem requirements in collaboration with R&D and packaging teams. · Draft and maintain MRDs, PRDs, product specifications, business plans, and project requirements, ensuring clear alignment across design, packaging, test, quality, operations, marketing, and sales teams. · Lead feasibility assessment, business-case development, project initiation, development reviews, risk management, product validation, qualification, and new product introduction to ensure on-time and high-quality delivery. · Take ownership of the full product lifecycle from concept and definition through mass production, portfolio optimization, change management, and end-of-life planning. 4. Partner and Supply-Chain Management · Coordinate internal and external resources across wafer suppliers, OSAT partners, substrate and lead-frame suppliers, test houses, and ecosystem partners to support product development and scalable production. · Participate in partner evaluation and selection, technical and commercial alignment, capacity planning, quality improvement, cost optimization, and supply-risk mitigation. 5. Data Analysis and Decision Support · Track product performance, design wins, revenue, gross margin, forecast, yield, quality, customer feedback, and competitive developments to evaluate business health and product competitiveness. · Use market and operational data to recommend roadmap adjustments, cost-reduction priorities, package or process improvements, and investment decisions to management. Qualifications 1. Education Background · Bachelor’s degree or above in Electronic Engineering, Microelectronics, Semiconductor Engineering, Materials Science, Automation, or a related discipline. A master’s degree or MBA is preferred. 2. Work Experience · Minimum 8 years of experience in semiconductor product management, product definition, system architecture, packaging engineering, application engineering, or related roles. · Proven hands-on experience with multi-die packaging or system-in-package products integrating two or more of the following device categories: MCU, gate driver, power device, power-management device, and memory device. · Demonstrated experience leading cross-functional semiconductor products from market opportunity and definition through development, qualification, mass production, and market launch. 3. Professional Skills · Product and System Expertise: Strong understanding of MCU architecture, gate-driver functions, power semiconductors, power-management devices, and memory technologies, including their system interactions and application trade-offs. · Packaging and Process Expertise: In-depth knowledge of semiconductor packaging architecture, die attach, interconnect, substrates or lead frames, thermal management, signal and power integrity, assembly, test, reliability, qualification, yield, and cost drivers. · Market Insight: Deep understanding of markets and applications where integration creates measurable value, with the ability to assess customer requirements, competitive alternatives, pricing, supply-chain factors, and business potential. · Documentation Skills: Proficient in developing MRDs, PRDs, product specifications, business plans, product roadmaps, competitive analyses, and executive decision materials. 4. Comprehensive Competencies · Communication & Collaboration: Strong cross-functional leadership and stakeholder-management skills, with the ability to align design, packaging, test, quality, operations, suppliers, sales, and customers around complex product decisions. · Commercial Acumen: Strong business-case, pricing, cost, margin, and portfolio-management capabilities, with sound judgment in balancing technical differentiation and commercial return. · English Proficiency: Fluent professional English, with the ability to read international technical documentation and participate effectively in cross-border technical and business discussions. More information about NXP in Greater China... #LI-67af NXP Semiconductors N.V. (NASDAQ: NXPI) enables a smarter, safer, and more sustainable world through innovation. As the world leader in secure connectivity solutions for embedded applications, NXP is pushing boundaries in the automotive, industrial & IoT, mobile, and communication infrastructure markets. For more information, visit www.nxp.com Bright Minds. Bright Futures. We believe that a key component to growing our business is to develop our people. To enable you to grow your career at NXP, we offer online and offline learning opportunities to help you develop some of your core and professional skills. Commitment At NXP. We recognize NXP is a powerful change agent as we continue to deliver innovative solutions that advance a more sustainable future. We remain steadfast in our commitment to sustainability and making measurable year-on-year progress. Also, we aim to create an inclusive work environment and we will not tolerate racism, discrimination or harassment of any kind. We have programs in place focused on diversity, inclusion and equality. Thank you for considering a career at NXP. To help you prepare for the different steps in our hiring process, see the following useful advice and tips. Are you already an NXP employee? Do not apply here. Instead, you must apply via our internal career page. Thank you for your interest in supporting our recruitment efforts. Please note that NXP operates under a strict Preferred Supplier List (PSL) for all recruitment activities. Any candidate profiles or resume submitted without a prior written agreement or explicit request from our Talent Acquisition team will be considered unsolicited. Such submissions will be deemed free of any obligations, and no fees will be paid by NXP or any of its affiliates, subsidiaries, or divisions - regardless of whether the candidate is hired, either coincidentally or otherwise. Thank you for your understanding.

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